{"id":151,"date":"2017-01-24T08:43:34","date_gmt":"2017-01-24T08:43:34","guid":{"rendered":"http:\/\/dummy.xtemos.com\/basel\/?p=151"},"modified":"2019-01-08T14:30:51","modified_gmt":"2019-01-08T14:30:51","slug":"wafer-inspection-scheme","status":"publish","type":"post","link":"https:\/\/www.sipotek.net\/wafer-inspection-scheme\/","title":{"rendered":"Wafer inspection scheme"},"content":{"rendered":"

Wafer Inspection Scheme Shenzhen SPOTECK Technology Co., Ltd., SPOTECK has been focusing on machine vision inspection for 13 years.<\/p>\n

There are a lot of testing cases, wide application areas, free sampling, development of testing programs, rapid outbound.<\/p>\n

 <\/p>\n

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1. Contents and requirements of testing<\/p>\n

Measure workpiece area:<\/p>\n

Appearance and Dimension Detection of Samples 1.44mm in Length, 1.43mm in Width and 1.65mm in Height<\/p>\n

Detection Contents: Damage, cracks, stomata, poor nickel layer<\/p>\n

1: Bottom Positive Detection Appearance<\/p>\n

2: Side Positive Detection Appearance<\/p>\n

3: Side Positive Detection Appearance<\/p>\n

4: Side Positive Detection Appearance<\/p>\n

5: Side Positive Detection Appearance<\/p>\n

6: Top Positive Detection Appearance<\/p>\n

Note: The above detection items need to be clearly visible under the image to detect.<\/p>\n

Detection efficiency: 250-350 pieces per minute (according to sample feeding speed).<\/p>\n

Division of work: Subdivide the detection steps according to the detection content.<\/p>\n

II. Equipment Composition and Major Institutions<\/p>\n

Overall Composition: Dimension: 900*800*1850 mm<\/p>\n

Model: SP_T300<\/p>\n

1:SPOTECK Visual Detection Software<\/p>\n

2: industrial computer<\/p>\n

3: display 19 inches<\/p>\n

4: Industrial cameras: 6 sets, 1 bottom, 4 side and 1 top.<\/p>\n

5: Industrial Lens: 6 FA Industrial Lens<\/p>\n

6: professional glass tray<\/p>\n

7: solenoid valve<\/p>\n

8: reducer<\/p>\n

9: vibration cabinet<\/p>\n

10: Feeding Equipment (Vibrating Disk, Direct Vibration, Controller)<\/p>\n

II.1: 3-D Stereogram of Equipment Appearance<\/p>\n

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3:1 Bottom Positive Detection Method<\/p>\n

Bottom Test Fine Product Analysis Chart: OK<\/p>\n

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 <\/p>\n

3:1 Bottom Positive Detection Method<\/p>\n

Bottom defective product analysis chart (fission): NG<\/p>\n

\"\"<\/p>\n

3:1 Bottom Positive Detection Method<\/p>\n

Bottom defective product analysis chart (bad nickel layer): NG<\/p>\n

\"\"<\/p>\n

 <\/p>\n

3:2 Side Positive Light Detection Method<\/p>\n

Analysis Chart of Fine Products for Side Detection: OK<\/p>\n

\"\"<\/p>\n

 <\/p>\n

3:2 Side Positive Light Detection Method<\/p>\n

Side detection defective product analysis chart (breakage): NG<\/p>\n

\"\"<\/p>\n

 <\/p>\n

3:2 Side Positive Light Detection Method<\/p>\n

Top defective product analysis chart (stomata): NG<\/p>\n

\"\"<\/p>\n

 <\/p>\n

3:3 Side Positive Light Detection Method<\/p>\n

Analysis Chart of Fine Products for Side Detection: OK<\/p>\n

\"\"<\/p>\n

3:3 Side Positive Light Detection Method<\/p>\n

Side detection defective product analysis chart (breakage): NG<\/p>\n

\"\"<\/p>\n

 <\/p>\n

3:3 Side Positive Light Detection Method<\/p>\n

Top defective product analysis chart (stomata): NG<\/p>\n

\"\"<\/p>\n

 <\/p>\n

IV. System Installation Requirements:<\/p>\n

Inspection space for equipment placement: Separately installing SP visual inspection system at the pipeline side, it is necessary to ensure that there is enough space to install the equipment.<\/p>\n

Ambient temperature: 0-50 degrees Celsius;<\/p>\n

Air humidity: below 90% RH;<\/p>\n

Electronic jamming: Provide equipment with less electronic jamming.<\/p>\n

Power supply: 220V, 50Hz AC, less than 1KVA power consumption, air pressure 0.35-0.7MPa<\/p>\n

Above is the wafer detection scheme, the main contents of detection are breakage, cracks, pore, poor nickel layer and size.<\/p>\n","protected":false},"excerpt":{"rendered":"

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